Construction：12 Layer/Immersion Silver
Material： FR-4(Mid Tg)
Board Thickness：63mil
Line Width Spacing：2.8/4.5mil
Copper Thickness：2 OZ Finished Outer
Unit Size（186.4*168mm）
Special Design requirement：0.25MM drill
hole with density at 131 holes/sqin
Higher Layer product
Application：Telecommunication