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Rigid PCB4

Date: 2018-12-18

Construction:12 Layer

Material: FR-4 High TG

Surface Finish:Immersion gold

Board Thickness:1.42+0.13/-0.22mm

Min.LW/LS:0.075/0.10mm

Min.Drill Size:0.2mm


1、HDI structure:3+N+3 with stacked via,platted for blind hole

2、VIPPO filled by Non-conductive and platted over

3、Vias are cleaned by plasma process

4、Specific impedance controlled with 55+/-5 Ohms 53+/-5 Ohms;

     Differential impedance controlled with 90+/-5% Ohms,

     100+/-10, Ohms,106Ω±12 Ohms

Rigid PCB4

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